Method of manufacturing nitride based semiconductor light-emitting device

ABSTRACT

Nitride based semiconductor light-emitting devices with a sufficiently low contact resistance p-type electrode and a method of manufacturing the same are disclosed. One such method of manufacturing nitride based semiconductor light-emitting devices includes steps of growing island-like AlGaN films  17  on p-type nitride based semiconductor layer  16,  etching a surface of p-type type nitride based semiconductor layer  16  to make uneven portions  18  on its surface by using island-like AlGaN films  17  as a photomask, and forming of a p-type ohmic electrode on an electrode forming region of the uneven portion  18.

FIELD OF THE INVENTION

This invention generally relates to nitride semiconductors of group IIIelements or nitride semiconductor light-emitting devices of mixedcrystals with such elements and a method of manufacturing the same and,more particularly, to nitride based semiconductor light-emitting deviceswith the structure suitable for high light flux especially when drivenby a large electric current (of several-hundred mA) and a method ofmanufacturing such light-emitting devices.

This application is based upon and claims the benefit of priority fromthe prior Japanese Patent Application No. 2002-367549, filed on Dec. 19,2002, the entire contents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

A light-emitting diode (LED) among semiconductor light-emitting devicesis widely used for full color displays, traffic light apparatus,automotive equipment, and the like.

Recently, since a gallium nitride based semiconductor (InGaAIN) LED canbe combined with fluorescent materials to emit white light for lightningapplications, it attracts considerable attention. In addition,developments have been actively directed to a high light flux LED drivenby a large electric current of more than several-hundred mA.

A method of manufacturing an LED of this kind will be explained belowwith reference to FIG. 11. By applying a metal organic chemical vapordeposition (MOCVD) method to sapphire substrate 101, buffer layer 102,n-type GaN contact layer 103, n-type AIGaN clad layer 104, multiplequantum well (MQW) active layer 105, p-type AIGaN clad layer 106 andp-type GaN contact layer 107 are formed on the (0001)C-plane of sapphiresubstrate 101 in that order.

Next, a reactive ion etching (RIE) is applied to remove portions fromthe multiple layers of p-type GaN contact layer 107 through n-type GaNcontact layer 103 to expose an n-type electrode region of n-type GaNcontact layer 103.

A p-type electrode 108 is formed on a flat upper surface of p-type GaNcontact layer 107, while an n-type electrode 109 is formed on the n-typeelectrode region of contact layer 103, so that an LED is manufactured.

In general, magnesium (Mg) is used as a p-type impurity. It iswell-known, however, that Mg has a relatively deep acceptor level in GaNcrystal, and an inert acceptor effect by atom-like hydrogen. Thus, Mgadded, p-type GaN contact layer 107 hardly obtains sufficient carrierconcentration and becomes high in electric resistance.

In the LED manufactured in the above mentioned method, contactresistance between p-type GaN contact layer 107 and p-type electrode 108increases, it is difficult for p-type GaN contact layer 107 to have agood ohmic contact with p-type electrode 108, and an operation voltageof the LED becomes high.

The conditions result in increase in generation of heat by the LED andbring about declines in performance and reliability.

In order to address these conditions, nitride based semiconductors and amethod of manufacturing the same are well-known (see, for example, thedescription at page 6 and FIG. 3 of Japanese Patent Disclosure2002-16312).

The method of manufacturing nitride based semiconductor devicesdisclosed in Japanese Patent Disclosure 2002-16312 will be brieflyexplained below with reference to FIG. 12. A sectional view of thenitride based semiconductor device (laser diode) is shown in FIG. 12.The same reference numerals are put on substantially the same componentsas of the conventional LED shown in FIG. 11 and their explanation isomitted here.

As shown in FIG. 12, a stripe-like uneven portion 110 (the uneven periodof which is a several μm to several tens of μm, and the concave depth ofwhich is several tens of nm to several hundreds of nm) is defined inthis p-type GaN contact layer 107 and p-type electrode 108 is engagedwith uneven portion 110.

In order to make uneven portion 110, a photomask made of silicon dioxide(SiO₂) or the like is formed on the upper surface of p-type GaN contactlayer 107, photoresist is coated on so processed contact layer 107 andphotolithography is applied to such coated contact layer 107 to make astripe pattern, and a reactive ion etching (RIE) is carried out for sotreated surface of p-type GaN contact layer 107.

A saw-tooth structure in a cross-sectional view and a grid-likestructure of crossed rectangular stripes in a cross-sectional view areshown in Japanese Patent Disclosure 2002-16312 as structures of unevenportion 110.

Since the electrode is provided on uneven portion 110 as set forthabove, a contact area of p-type electrode 108 with p-type GaN contactlayer 107 increases and its contact resistance reduces.

The nitride based semiconductor device and its manufacturing methoddisclosed in Patent Publication 1, however, are complicated inmanufacturing process, take a substantially long time to manufacture,and result in increase in production cost because they need thephotolithography process to make the stripe-like uneven portion and theRIE process.

Present photolithography technology is hard to use in making a minuteuneven portion with a stripe period of less than several μm of the abovedescribed limit in order to increase a contact area or to decreaseelectric contact resistance.

Because of the reasons set forth above, it is difficult to lower theoperation voltage of the LED and also impossible to secure a sufficientvoltage for a high light flux LED driven by a large electric current ofmore than several-hundred mA.

The reliability of the LED is likely to be affected by possiblecontamination of silicon from SiO₂ photomask, residue damages due to theRIE process, and most likely uneven stress from a molded resin in thestripe-like uneven portion.

As explained above, it is quite difficult for the manufacturing methodof the nitride based semiconductor devices disclosed in PatentPublication 1 to provide those semiconductor devices with a p-typeelectrode of sufficiently low electric contact resistance.

SUMMARY OF THE INVENTION

It is, accordingly, an object of the present invention to providenitride based semiconductor devices with a p-type electrode ofsufficiently low electric contact resistance and a method ofmanufacturing the same easily.

According to one aspect of the present invention, a method ofmanufacturing nitride based semiconductor light-emitting devices maycomprise forming of, in turn, a first conductive type nitride basedsemiconductor layer, an active nitride based semiconductor layer havinga p-n junction, and a second conductive type nitride based semiconductorlayer on a semiconductor or an insulation substrate, growing of anisland-like AlGaN film on the second conductive type nitride basedsemiconductor, selectively etching to make uneven portions on a surfaceof the second nitride based semiconductor layer through the island-likeAlGaN film as a photomask, and forming of an ohmic electrode on theuneven portions on the surface of the second nitride based semiconductorlayer.

According to the present invention, a method of manufacturing nitridebased semiconductor light-emitting devices may comprise growing of anisland-like AlGaN film on the second conductive type nitride basedsemiconductor, selectively etching of a surface of the second conductivetype nitride based semiconductor through the island-like AlGaN film usedfor a photomask to make uneven portions on the surface of the secondconductive type nitride based semiconductor. Thus, the second conductivetype nitride based semiconductor easily increases its contact area withthe electrode and is provided with sufficiently low electric contactresistance.

According to a second aspect of the present invention, a nitride basedsemiconductor light-emitting device may comprise a semiconductor orinsulation substrate, a first conductive type nitride basedsemiconductor formed on the substrate, an active layer formed on thefirst conductive type nitride based semiconductor and made from anitride based semiconductor with a p-n junction, a second conductivetype nitride based semiconductor formed on the active layer, a surfaceof second conductive type nitride based semiconductor provided withuneven portions, a first ohmic electrode formed on the surface of thesecond conductive type nitride based semiconductor, and a second ohmicelectrode formed on the first conductive type nitride basedsemiconductor.

Thus, the uneven portions formed on the surface of the second conductivetype nitride based semiconductor result in increase of a contact areawith the first electrode and provide sufficiently low electric contactresistance.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the present invention and many of theattendant advantages thereof will be readily obtained as the samebecomes better understood by reference to the following detaileddescriptions when considered in connection with the accompanyingdrawings, wherein:

FIG. 1 shows a schematically sectional view of a nitride basedsemiconductor light-emitting device made in the first step of a methodof manufacturing the same in accordance with the first embodiment of thepresent invention;

FIG. 2A is a schematic plan view of the nitride based semiconductorlight-emitting device made in the second step of the manufacturingmethod in accordance with the first embodiment of the present invention;

FIG. 2B is a schematically sectional view of the nitride basedsemiconductor light-emitting device cut along line B-B of FIG. 2A;

FIG. 3 is a schematically sectional view of the nitride basedsemiconductor light-emitting device made in the third step of themanufacturing method in accordance with the first embodiment of thepresent invention;

FIG. 4 is a relative etching rate characteristic with respect to Alcomposition in an AlGaN semiconductor device made in accordance with themanufacturing method of the first embodiment of the present invention;

FIG. 5A is a schematically sectional view of the nitride basedsemiconductor light-emitting device made in the fourth step of themanufacturing method in accordance with the first embodiment of thepresent invention;

FIG. 5B is a partially enlarged sectional view of the nitride basedsemiconductor light-emitting device shown in FIG. 5A;

FIG. 6 is a schematically sectional view of the nitride basedsemiconductor light-emitting device made in the fifth step of themanufacturing method in accordance with the first embodiment of thepresent invention;

FIG. 7 is a schematically sectional view of the nitride basedsemiconductor light-emitting device made in the sixth step of themanufacturing method in accordance with the first embodiment of thepresent invention;

FIGS. 8A-8D are schematic process diagrams of a nitride basedsemiconductor light-emitting device made by a method of manufacturingthe same in accordance with the second embodiment of the presentinvention;

FIG. 9 is a schematically sectional view of a nitride basedsemiconductor light-emitting device of the present invention;

FIG. 10 is a schematically sectional view of a nitride basedsemiconductor light-emitting apparatus of the present invention;

FIG. 11 is a schematically sectional view of a nitride basedsemiconductor light-emitting device made by a prior art method ofmanufacturing the same; and

FIG. 12 is a schematically sectional view of a nitride basedsemiconductor light-emitting device with an uneven electrode definingsurface made by a prior art method of manufacturing the same.

DETAILED EXPLANATION OF THE PREFERRED EMBODIMENTS

Embodiments of the present invention will be explained below withreference to the attached drawings. It should be noted that the presentinvention is not limited to the embodiments but covers theirequivalents. Throughout the attached drawings, similar or same referencenumerals show similar, equivalent or same components. The drawings,however, are shown schematically for the purpose of explanation so thattheir components are not necessarily the same in shape or dimension asactual ones. In other words, concrete shapes or dimensions of thecomponents should be considered as described in these specifications,not in view of the ones shown in the drawings. Further, some componentsshown in the drawings may be different in dimension or ratio from eachother.

First Embodiment

FIGS. 1-7 show sectional views of a nitride based semiconductor devicemade by a series of portions of a method of manufacturing the same inaccordance with the first embodiment of the present invention.

As shown in FIG. 1, a nitride based semiconductor layer is grown on the(0001)C-plane of a sapphire substrate 11. Here, hydrogen or mixed gasesof hydrogen and nitrogen are used as carrier gases. Organic metalcompounds Al, Ga, and In of trimethylaluminum (TMA), trimethylgallium(TMG) and trimethylindium (TMI) are utilized for group III materialgases while ammonia (NH₃) is utilized for a group V material gas. Asilane gas (SiH₄) is employed as an n-type dopant, i.e., a firstconductive types semiconductor while organic metal compounds ofmagnesium, e.g., bis (cyclopentadienyl) magnesium (Cp2Mg) is employed asa p-type dopant, i.e., a second conductive types semiconductor.

At the beginning, sapphire substrate 11 is set in a reaction chamber ofa metal organic chemical vapor deposition (MOCVD) apparatus. Aftercontents of the chamber are fully substituted for hydrogen, thesubstrate is heated up to a temperature of 1050° C. while hydrogen flowsinto the chamber so that a thermal cleaning of the substrate is carriedout.

Next, n-type GaN contact layer 12 and n-type AlGaN clad layer 13 whichare doped with Si are, by turns, formed on sapphire substrate 11 as thefirst conductive type nitride based semiconductor layers. Since then-type GaN contact layer 12 doped with Si gains high carrierconcentration, it has sufficiently low electric contact resistance withan n-type electrode.

Subsequently, MQW active layer 14 is formed comprising a nitride basedsemiconductor layer with a p-n junction. The structure of MQW activelayer 14 is multiple layers of InGaN/GaN. Its light-emitting wavelengthcan be suitably selected from those of blue-green to ultraviolet inaccordance with In compositions of the InGaN semiconductor layer.

Then, as the second conductive type nitride based semiconductor layers,p-type AlGaN clad layer 15 and p-type GaN contact layer 16 both dopedwith magnesium Mg are, by turns, formed on n-type AlGaN clad layer 13.

As shown in FIGS. 2A and 2B, p-type AlGaN films 17 are grown on p-typeGaN contact layer 16. FIG. 2A is a schematic plan view of p-type AlGaNfilms 17. FIG. 2B is a schematically sectional view of p-type AlGaNfilms 17 cut along dotted and chain line B-B of FIG. 2A and seen fromthe arrows' direction.

In general, a growing temperature of the AlGaN semiconductor ranges from800° C. to 1200° C. and, more suitably, from 900° C. or more for theAlGaN semiconductor to easily grow in a two-dimensional direction to1150° C. or less for the AlGaN semiconductor to actively thermallydecompose.

Here, the growing temperature of the p-type AlGaN semiconductor is setat 900° C., for instance, to prevent it from two dimensional growth.Thus, the AlGaN semiconductor is grown in a three-dimensional directioninto island-like AlGaN films 17 with many, substantially, hexagons ofseveral μm to several tens of μm in width.

The shapes of those islands can be controlled by nitrogen used for acarrier gas, flowing rates of mixed gases of hydrogen and nitrogen, orchanges in growing temperature.

Further, when island-like AlGaN films 17 become a predeterminedthickness, e.g., 0.1 μm, the material gases of TMA and TMG are stoppedand island-like AlGaN films 17 cease growing.

As shown in FIG. 3, the surface of p-type GaN contact layer 16 is etchedthrough island-like AlGaN films 17 as a photomask by exposing p-type GaNcontact layer 16 to hydrogen or mixed gasses of hydrogen and nitrogen.This treatment can be carried out successively by stopping supplying anammonium gas after island-like AlGaN films 17 cease growing.

Applicant's experiments show that the etching speed of p-type GaNcontact layer 16 can be controlled by selection of atmospheric gases ortreatment temperature, and further that it can be also controlled bycomposition rates of Al to island-like AlGaN films 17.

By way of example, where the atmospheric gases are mixed ones ofhydrogen and nitrogen at the mixing rate of H2:N2=1:9 and the treatmenttemperature is at 900° C., the etching rate is 0.002 μm/sec. Where theatmospheric gas is hydrogen and the treatment temperature is at 1,000°C., the etching rate is 0.4 μm/sec.

FIG. 4 shows a relative etching rate characteristic with respect to Alcomposition in AlGaN films with respect to a GaN contact layer inatmospheric gas of hydrogen at the treatment temperature of 900° C. Asshown in FIG. 4, the etching rate of AlGaN films is ⅕ of that of GaNcontact layer at Al composition ratio of 0.05 but no substantial etchingof the former is carried out at Al composition ratio of 0.07 or more.

As set forth above, p-type GaN contact layer 16 can be selectivelyetched by using p-type AlGaN films 17 as a photomask.

Island-like AlGaN films 17 are 0.1 μm in thickness, Al composition ratiois 0.05, a mixed gas ratio of hydrogen and nitrogen H2:N2=1:1, and theetching is carried out at a temperature of 900° C. until the photomaskof island-like AlGaN films 17 vanishes, as shown in FIG. 5A, to make aplurality of mixed protrusions 18 small or large.

Here, microscopic observations show that the surface of the protrusionis rough and that many minute recesses 18 c are defined on it as shownin FIG. 5B. It is assumed that thermal decomposition occurs at the outerlayer of p-type GaN contact layer 16 to result in the recesses 18 c whenthe etching is carried out.

After the etching treatment, metal droplets of Ga sometimes remain onthe surface of p-type GaN contact layer 16. Substrate 11 is taken outfrom the reaction chamber after the etching treatment and is processedby chlorine system etchant so that the metal droplets can be removedfrom the surface of p-type GaN contact layer 16.

Next, activation treatment is performed for Mg doped p-type GaN contactlayer 16 to make its resistivity equal to or less than 1 Ωcm.

Nickel (Ni) and gold (Au) are then vapor-deposited on recesses 18 c ofprotrusions 18 and the surface of p-type GaN contact layer 16 to whichthermal treatment is further applied to form p-type electrode 19 asshown in FIG. 6.

A photolithography method is employed to form a transmission linepattern on p-type electrode 19. Applicant's measurement shows that itscontact resistance is 2×10⁻⁴ Ωcm², i.e., that it can reduce to ⅕ of thatof a prior art plane electrode contact resistance of 1×10⁻³ Ωcm².

This improvement rate is much greater than an increment rate of theouter layer by protrusions 18. Although its reason is now unclear, it ispossible to suppose that something makes contact characteristicsimproved on sides different in plane direction from the planes of unevenportions. Electrode materials, for example, enter into recesses 18 c ofprotrusions 18 to increase contact areas.

Further, there are regions in the outer layer of protrusions 18 where agroup V element of nitrogen is lost and III-V crystalline structure isdestroyed, i.e., the “regions that are from stoichiometriccompositions”. They may be related to such improvement.

In this way, the formation of protrusions 18 on p-type GaN contact layer16 makes contact resistance between p-type GaN contact layer 16 andp-type electrode 19 reduced. In addition, recesses 18 c of protrusions18 make such contact resistance much lower.

Next, an RIE method is applied to remove a part of the layers rangingfrom p-type GaN contact layer 16 through n-type GaN contact layer 12 toexpose the n-type electrode region of n-type GaN contact layer 12.

Titanium and aluminum Ti and Al are vapor-deposited on the exposed flatplane of the n-type electrode region to which thermal treatment isfurther applied to form n-type electrode 20. Thus, a light-emittingdiode LED 21 with the structure of transparent p-type electrode 19 isproduced.

When this LED 21 is mounted on a lead frame, not shown, and is operated,an operation voltage is 3.2 V with an operation current of 200 mA. Thus,such an operation voltage is lower than that of 3.5 V of a prior artstructured LED that has no protrusions 18 on p-type GaN contact layer16.

Further, output light measured after the LED 21 is covered with amolding material, not shown, is found to improve to an extent of 10%increase. This improvement in optical output efficiency of LED 21supposedly results from light-scattering effects of small or largeprotrusions 18. The reliability of a molding resin is equal to that of aprior art one.

As described above, the method of manufacturing nitride basedsemiconductor light-emitting devices according to the first embodimentof the present invention includes the step to continuously formprotrusions 18 on p-type GaN contact layer 16 in the reaction chamber ofthe metal organic chemical vapor deposition (MOCVD) apparatus usingisland-like AlGaN films 17 as a photomask.

Thus, contact areas between p-type GaN contact layer and p-typeelectrode 19 increase and sufficiently low contact resistance can beobtained. Their manufacturing process is easy and simple because it isunnecessary to use a photolithography step or an RIE step.

Second Embodiment

FIGS. 8A-8D are sectional views of a series of forming steps ofprotrusions 18 in a method of manufacturing nitride based semiconductorlight-emitting devices according to the second embodiment of the presentinvention. The components of this embodiment which are the same as orsimilar to the first embodiment have the same reference numerals as forthe latter and their explanation are omitted here for simplicity.

As shown in the drawings, steps of the second embodiment that aredifferent from those of the first one are directed to two-time repeatingformation of much sharper protrusions 18.

After island-like p-type AlGaN films 17 properly are grown on p-type GaNcontact layer 16, the surface of p-type GaN contact layer 16 is etchedto form protrusions 18 by using p-type AlGaN films 17 as a photomask asshown in FIGS. 8A and 8B.

Next, as shown in FIG. 8C, island-like AlGaN films 17 a that are smallerin size than island-like AlGaN films 17 are again grown on p-type GaNcontact layer 16 with protrusions 18.

It is desirable to grow the islands in a lower temperature where theislands are made smaller in size. It is possible to make the islandseven less than several μm in size.

Thus, island-like AlGaN films 17 a can be formed on the top ofprotrusions 18 and between protrusions 18. AlGaN films 17 a are alsoformed on the side surfaces of protrusions 18 but the films are removedand disappears by etching in the next step so that the films do notremarkably affect the semiconductor light-emitting device.

Next, as shown in FIG. 8D, p-type GaN contact layer 16 is etched againby using island-like AlGaN films 17 a as a photomask. Thus, high andacute protrusions 18 a and new ones 18 b are formed.

Many small and large protrusions 18 a and 18 b are formed in this way sothat contact areas with the p-type electrode increase and its contactresistance becomes lower.

As described above, the method of manufacturing nitride basedsemiconductor light-emitting devices according to the second embodimentof the present invention includes steps to continuously form protrusions18 a and 18 b on p-type GaN contact layer 16 in the reaction chamber ofthe MOCVD apparatus using island-like AlGaN films 17 and 17 a asphotomasks.

Thus, contact areas between p-type GaN contact layer 16 and p-typeelectrode 19 further increase and sufficiently lower contact resistancecan be obtained. Their manufacturing process is easy and simple becauseit is unnecessary to use a photolithography and an REI method.

Next, a further embodiment of a nitride based semiconductorlight-emitting device will be explained below with reference to FIGS. 9and 10. FIG. 9 is a sectional view of the nitride based semiconductorlight-emitting device manufactured by the method in accordance with thefirst embodiment of the present invention.

As shown in FIG. 9, this light-emitting device of the embodimentincludes Si doped n-type GaN contact layer 12 as a fist conductive typenitride based semiconductor layer and n-type AlGaN clad layer 13 whichare, by turn, formed on the (0001) C plane of sapphire substrate 11. Themulti-layer structure of InGa/GaN of MQW active layer 14 is formed onn-type AlGaN clad layer 13 as an active layer of a nitride basedsemiconductor layer with a p-n junction. Further, Mg doped p-type AlGaNclad layer 15 and p-type GaN contact layer 16 are, by turn, formed assecond conductive type nitride based semiconductor layers.

The p-type GaN contact layer 16 has small and large protrusions 18formed on its surface. Large protrusions 18 are several μm to severaltens of μm in size while small ones 18 are hundreds of nm to several μmin size but protrusions 18 are hundreds of nm to 1 μm in height. Thedensity of protrusions 18 is approximately 10⁴ mm⁻².

Further, p-type electrode 19 a of Ni/Au is formed on an electrodeforming area of p-type GaN contact layer 16 with protrusions 18.

An RIE method is applied to etch p-type GaN contact layer 16 throughpart of n-type GaN contact layer 12. Then, the part of n-type GaNcontact layer 12 is exposed to make an electrode forming area on whichn-type electrode 20 a of Ti/Al is formed. Thus, a flip-chip type LED 31is produced.

FIG. 10 is a sectional view of a nitride based semiconductorlight-emitting device incorporated with LED 31 shown in FIG. 9.

As shown, LED 31 is set on reflection cup 33 to make sapphire substrate11 a light-emitting observation plane while p-type electrode 19 a andn-type electrode 20 a are fixed on lead frame 34 a and 34 b by ballbonding, respectively.

Transparent gel resin material 35 is filled in reflection cup 33 andtransparent resin lens 36 is fixed to enclosure 32 to make nitride basedsemiconductor light-emitting apparatus 37.

This semiconductor light-emitting apparatus 37 operates at 3.2 V with anoperation current of 200 mA. The operation voltage of 3.2 V can bereduced in comparison with that of 3.5 V of a prior art semiconductorlight-emitting apparatus without protrusions 18 on p-type GaN contactlayer 16.

Further, when the operation current is increased, the entire surface ofthe activated layer emits light while no substantial current isconcentrated at any portions. Its light output saturation due togenerated heat is not observed nor is its reliability deteriorated,either.

As explained above, according to the nitride based semiconductorlight-emitting device of the present invention, protrusions 18 formed onp-type GaN contact layer 16 increases its contact area with p-typeelectrode 19 a, and provides sufficiently lower contact resistance, anda sufficiently lower operation voltage can be obtained for a highoptical flux LED driven by a large current.

As many apparently different embodiments of the present invention may bewidely made without departing from its spirit and scope, it is to beunderstood that the invention is not limited to the specific embodimentsset forth above. Instead of forming island-like AlGaN films 17 andsubsequently etching GaN contact layer 16 by using island-like AlGaNfilms 17 as a photomask in the same reaction chamber, those processesmay be carried out in separate reaction chambers.

The contact layer 16 is not limited to p-typeGaN semiconductors but mayalso be nitride based semiconductors including Al or In.

Although the process is repeated twice to form protrusions 18 a and 18b, additional processes may be repeated while changing the size orthickness of island-like AlGaN films 17 and Al composition rates.

Further, sapphire substrate 11 may be substituted for SiC or GaNsemiconductor substrates.

The present invention easily provides nitride based semiconductorlight-emitting devices with a sufficiently lower resistance p-typeelectrode and a sufficiently lower operation voltage, and a method ofmanufacturing the same.

1. A method of manufacturing nitride based semiconductor light-emittingdevices, comprising: forming of a first conductive type nitride basedsemiconductor layer, an active layer with a p-n junction, and a secondconductive type nitride based semiconductor layer by turns on asubstrate; growing of island-like A1GaN film on said second conductivetype nitride based semiconductor layer; etching of a surface of saidsecond conductive type nitride based semiconductor layer to make unevenportions on said surface thereof; and forming of an ohmic electrode onsaid uneven portion of said surface of said second conductive typenitride based semiconductor layer.
 2. A method of manufacturing nitridebased semiconductor light-emitting devices, according to claim 1,wherein said uneven portions are protrusions.
 3. A method ofmanufacturing nitride based semiconductor light-emitting devices,according to claim 2, wherein said uneven portions are provided withfine recesses on a surface thereof.
 4. A method of manufacturing nitridebased semiconductor light-emitting devices according to claim 2, whereinsaid uneven portions are provided with regions on a surface thereofwhich are out of stoichiometric compositions.
 5. A method ofmanufacturing nitride based semiconductor light-emitting devicesaccording to claim 1, wherein said growing of said island-like A1GaNfilm on said second conductive type nitride based semiconductor layeremploys carrier gases of nitrogen and hydrogen and is carried out byapplying a metal organic chemical vapor deposition method at atemperature range within which said A1Ga film is grown substantially intwo-dimension, and said etching of said surface of said secondconductive type nitride based semiconductor layer is carried out byheating said surface of said second conductive type nitride basedsemiconductor layer in hydrogen or mixed gases of hydrogen and nitrogen.6. A method of manufacturing nitride based semiconductor light-emittingdevices according to claim 1, wherein said growing of said island-likeA1GaN film on said second conductive type nitride based semiconductorlayer and said etching of said surface of said second conductive typenitride based semiconductor layer are continuously carried out once orrepeatedly in a metal organic chemical vapor deposition chamber. 7-11.(canceled)
 12. A method of manufacturing nitride based semiconductorlight-emitting devices according to claim 2, wherein said growing ofsaid island-like A1GaN film on said second conductive type nitride basedsemiconductor layer employs carrier gases of nitrogen and hydrogen andis carried out by applying a metal organic chemical vapor depositionmethod at a temperature range within which said AlGa film is grownsubstantially in two-dimension, and said etching of said surface of saidsecond conductive type nitride based semiconductor layer is carried outby heating said surface of said second conductive type nitride basedsemiconductor layer in hydrogen or mixed gases of hydrogen and nitrogen.13. A method of manufacturing nitride based semiconductor light-emittingdevices according to claim 3, wherein said growing of said island-likeA1GaN film on said second conductive type nitride based semiconductorlayer employs carrier gases of nitrogen and hydrogen and is carried outby applying a metal organic chemical vapor deposition method at atemperature range within which said AlGa film is grown substantially intwo-dimension, and said etching of said surface of said secondconductive type nitride based semiconductor layer is carried out byheating said surface of said second conductive type nitride basedsemiconductor layer in hydrogen or mixed gases of hydrogen and nitrogen.14. A method of manufacturing nitride based semiconductor light-emittingdevices according to claim 4, wherein said growing of said island-likeA1GaN film on said second conductive type nitride based semiconductorlayer employs carrier gases of nitrogen and hydrogen and is carried outby applying a metal organic chemical vapor deposition method at atemperature range within which said AlGa film is grown substantially intwo-dimension, and said etching of said surface of said secondconductive type nitride based semiconductor layer is carried out byheating said surface of said second conductive type nitride basedsemiconductor layer in hydrogen or mixed gases of hydrogen and nitrogen.15. A method of manufacturing nitride based semiconductor light-emittingdevices according to claim 2, wherein said growing of said island-likeA1GaN film on said second conductive type nitride based semiconductorlayer and said etching of said surface of said second conductive typenitride based semiconductor layer are continuously carried out once orrepeatedly in a metal organic chemical vapor deposition chamber.
 16. Amethod of manufacturing nitride based semiconductor light-emittingdevices according to claim 3, wherein said growing of said island-likeA1GaN film on said second conductive type nitride based semiconductorlayer and said etching of said surface of said second conductive typenitride based semiconductor layer are continuously carried out once orrepeatedly in a metal organic chemical vapor deposition chamber.
 17. Amethod of manufacturing nitride based semiconductor light-emittingdevices according to claim 4, wherein said growing of said island-likeA1GaN film on said second conductive type nitride based semiconductorlayer and said etching of said surface of said second conductive typenitride based semiconductor layer are continuously carried out once orrepeatedly in a metal organic chemical vapor deposition chamber.
 18. Amethod of manufacturing nitride based semiconductor light-emittingdevices according to claim 5, wherein said growing of said island-likeA1GaN film on said second conductive type nitride based semiconductorlayer and said etching of said surface of said second conductive typenitride based semiconductor layer are continuously carried out once orrepeatedly in a metal organic chemical vapor deposition chamber.